
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 3-719: Test Methods For Interconnection Structures (Printed Boards) - Test 3E19: Monitoring Of Single Plated-Through Hole (Pth) Resistance Change During Thermal Cycling
出版:Swiss Standards

专家解读视频
2016 [12/04/2016]2016 [01/01/0001]
IEC 61189-3-719 : 1ED 2016 - Identical
EN 61189-3-719 : 2016 - Identical
EN 61189-3-719:2016 - Identical