
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING T
出版:International Electrotechnical Committee

专家解读视频
Defines a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
DS EN 61189-3-719 : 2016 - Identical
BS EN 61189-3-719 : 2016 - Identical
NEN EN IEC 61189-3-719 : 2016 - Identical
DIN EN 61189-3-719 : 2014 - Identical
NF EN 61189-3-719 : 2016 - Identical
SN EN 61189-3-719 : 2016 - Identical
PN EN 61189-3-719 : 2016 - Identical
CEI EN 61189-3-719 : 2016 - Identical
NBN EN 61189-3-719 : 2016 - Identical