IEC 61191-3 Ed. 1.0被替代
Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
出版：International Electrotechnical Committee
专家解读视频
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
DIN EN 61191-3 (1999-06) - Identical
NF EN 61191-3:2000 - Identical
I.S. EN 61191-3:1999 - Identical
PN EN 61191-3:2005 - Identical
SS EN 61191-3 Ed. 1 (1998) - Identical
ONORM OVE EN 61191-3:1998 - Identical
CEI EN 61191-3 Ed. 1 (2005) - Identical
SN EN 61191-3:1998 - Identical
NEN EN IEC 61191-3:1999 - Identical
BS EN 61191-3:1999 - Equivalent
JIS C 61191-3:2006 - Identical
