NF EN 61191-3:2000现行
Printed Board Assemblies - Part 3: Sectional Specification - Requirements For Through-hole Mount Soldered Assemblies
出版：Association Francaise de Normalisation
专家解读视频
Gives requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that also include other relating technologies (i.e. chip mounting, surface mount, terminal mounting)
Indice de Classement: C90-705
DIN EN 61191-3 (1999-06) - Identical
BS EN 61191-3:1999 - Identical
SN EN 61191-3:1998 - Identical
SN EN 61191-3:2017 - Identical
BS EN 61191-3:2017 - Identical
EN 61191-3:2017 - Identical
DIN EN 61191-3 : 2016 - Identical
DIN EN 61191-3 : 2016 - Identical
IEC 61191-3 Ed. 1.0 - Identical
NBN EN 61191-3:1999 - Identical
I.S. EN 61191-3:1999 - Identical
SS EN 61191-3 Ed. 1 (1998) - Identical
