J STD 002:2007被替代
Solderability Tests For Component Leads, Terminations, Lugs, Terminals And Wires
出版：Institute of Printed Circuits
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基本信息
标准编号： J STD 002:2007
标准类别：Standard
出版单位：Institute of Printed Circuits
标准页数：0
标准简介
Prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. Also includes a test method for the Resistance to Dissolution/Dewetting of Metallization.
标准备注
Supersedes IPC S 805, EIA IS 49 & EIA 638. Also available in CD-ROM format. Included in IPC C 103 & IPC C 1000. Also available in Chinese Language, See J STD 002 CHINESE. Supersedes EIA 364-52. C2007 Edition Re-Issued in November 2008 & incorporates AMD 1 2008. (07/2009)
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