DS EN 60749-19:2003现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 19: Die Shear Strength
出版：Danish Standards
专家解读视频
基本信息
标准编号： DS EN 60749-19:2003
发布时间：2010/12/19 0:00:00
标准类别：Standard
出版单位：Danish Standards
标准页数：20
标准简介
Describes the integrity of materials and procedures used to attach semiconductors die to package headers or other substrates (for the purpose of this test method, the term "semiconductors die" should be taken to include passive elements).
等同采用的国际标准
EN 60749-19:2003 - Identical
