
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 3-719: Test Methods For Interconnection Structures (Printed Boards) - Monitoring Of Single Plated-Through Hole (Pth) Resistance Change During Temperature Cycling
出版:Association Francaise de Normalisation

专家解读视频
2016 [01/11/2016]2014 PR [01/11/2014]
Indice de classement: C93-733-719. PR NF EN 61189-3-719 November 2014. (12/2014)
EN 61189-3-719:2016 - Identical
EN 61189-3-719 : 2016 - Identical
IEC 61189-3-719 : 1ED 2016 - Identical