IEC 60068-2-58 Ed. 4.1现行
Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC 60068-2-58 Ed. 4.1
发布时间：2017/7/28 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：73
标准简介
Gives procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
本标准替代的旧标准
