IPC SP 819:1988被替代
Specification For Solder Pastes
出版：Institute of Printed Circuits
专家解读视频
基本信息
标准编号： IPC SP 819:1988
标准类别：Standard
出版单位：Institute of Printed Circuits
标准页数：0
标准简介
Prescribes general requirements for the description and testing of solder paste used in the soldering of surface-mount components or in the general soldering of electronic interconnections. It defines the characteristics of solder paste through the definition of properties and the specification of test methods and inspection criteria. The materials covered include solder powder and solder-paste flux that are blended together to produce a solder paste. The solder powders are classified as to the shape and the size distribution of the particles.
替代本标准的新标准
