
Soft Solder Alloys - Chemical Compositions And Forms (Iso 9453:2014)
出版:Asociacion Espanola de Normalizacion

专家解读视频
Describes the requirements for chemical composition for the following families of soft solder alloys: - tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; - tin-antimony; - tin-bismuth; - tin-copper, with and without silver; - tin-indium, with and without silver and bismuth; - tin-silver, with and without copper and bismuth; - tin-zinc, with and without bismuth.
Supersedes UNE EN 29453. (03/2007)
ONORM EN ISO 9453:2014 - Identical
DIN EN ISO 9453 (2014-12) - Identical
NBN EN ISO 9453:2014 - Identical
NF EN ISO 9453:2014 - Identical
SN EN ISO 9453:2014 - Identical
NS EN ISO 9453:2014 - Identical
NEN EN ISO 9453:2014 - Identical
BS EN ISO 9453:2014 - Identical
I.S. EN ISO 9453:2014 - Identical
SS EN ISO 9453 Ed. 2 (2014) - Identical