DS EN 60749-20:2009现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 20: Resistance Of Plastic Encapsulated Smds To The Combined Effect Of Moisture And Soldering Heat
出版：Danish Standards
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基本信息
标准编号： DS EN 60749-20:2009
发布时间：2010/2/26 0:00:00
标准类别：Standard
出版单位：Danish Standards
标准页数：36
标准简介
Specifies a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
等同采用的国际标准
EN 60749-20:2009 - Identical
