SEMI E181 : 2021现行
Specification for Panel FOUP for Panel Level Packaging
出版：Semiconductor Equipment & Materials Institute
专家解读视频
基本信息
标准编号： SEMI E181 : 2021
标准类别：Standard
出版单位：Semiconductor Equipment & Materials Institute
标准页数：0
标准简介
The purpose of this Document is to establish basic physical dimensions for the Panel FOUP intended to be used to transport and store panels, as specified by SEMI 3D20 for 510 mm × 515 mm panel size and 600 mm × 600 mm panel size.
