JIS C 60068-2-58:2016现行
Environmental Testing - Part 2-58: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
出版：Japanese Standards Association
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基本信息
标准编号： JIS C 60068-2-58:2016
发布时间：2016/12/20 0:00:00
标准类别：Standard
出版单位：Japanese Standards Association
标准页数：26
标准简介
Outlines test Td, applicable to surface mounting devices (SMD). Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD).
