IEC 62880-1 Ed. 1.0现行
Semiconductor devices - Stress migration test standard Part 1: Copper stress migration test standard
出版：International Electrotechnical Committee
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基本信息
标准编号： IEC 62880-1 Ed. 1.0
发布时间：2017/8/23 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：28
标准简介
Specifies a constant temperature (isothermal) aging method for testing copper (Cu) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding (SIV).
