SN EN ISO 9453:2007被替代
Soft Solder Alloys - Chemical Compositions And Forms
出版：Swiss Standards
专家解读视频
Describes the requirements for chemical composition for the following families of soft solder alloys: - tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; - tin-antimony; - tin-bismuth; - tin-copper, with and without silver; - tin-indium, with and without silver and bismuth; - tin-silver, with and without copper and bismuth; - tin-zinc, with and without bismuth.
Supersedes SN EN 29453 (03/2007)
NF EN ISO 9453:2007 - Identical
NBN EN ISO 9453:2007 - Identical
DIN EN ISO 9453 (2006-12) - Identical
BS EN ISO 9453:2006 - Identical
ONORM EN ISO 9453:2007 - Identical
SS EN ISO 9453 Ed. 1 (2006) - Identical
NEN EN ISO 9453:2006 - Identical
ISO 9453:2006 - Identical
UNI EN ISO 9453:2007 - Identical
UNE EN ISO 9453:2007 - Identical
NS EN ISO 9453 Ed. 1 (2007) - Identical
I.S. EN ISO 9453:2006 - Identical
NS EN ISO 9453:2014 - Identical
NBN EN ISO 9453:2014 - Identical
BS EN ISO 9453:2014 - Identical
NEN EN ISO 9453:2014 - Identical
SS EN ISO 9453 Ed. 2 (2014) - Identical
NF EN ISO 9453:2014 - Identical
