
PLASTIC MICROCIRCUIT PACKAGES: A TECHNOLOGY REVIEW
出版:The Reliability Information Analysis Center

专家解读视频
Gives a critical review of the current information available on the reliability and related issues pertaining to plastic encapsulated microcircuits (PEMs). Numerous reports and studies have been published in scattered symposia and journals in this area since the RAC publication, IC Quality Grades: Impact on System Reliability and Life Cycle Cose in 1985. This report will bring together in one reference a summary of the current state-of-the-art. The information presented is based upon the results of an extensive literature review and discussions with industry experts. Included are sections on each of the following issues; costs, availability, quality and reliability and failure mechanisms. The annotated bibliography provides an extensive listing of over 200 references relating to this topic area.