SEMI 3D8:2021现行
Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
出版：Semiconductor Equipment & Materials Institute
专家解读视频
基本信息
标准编号： SEMI 3D8:2021
标准类别：Guide
出版单位：Semiconductor Equipment & Materials Institute
标准页数：0
标准简介
This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by defining the items/parameters needed to procure virgin silicon carrier wafers to be used in a 3DS-IC process.
本标准替代的旧标准
