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IEC 60068-2-54 Ed. 2.0被替代

Environmental testing Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

出版：International Electrotechnical Committee

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基本信息

标准编号： IEC 60068-2-54 Ed. 2.0

发布时间：2006/4/27 0:00:00

标准类别：Standard

出版单位：International Electrotechnical Committee

标准页数：37

标准简介

IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).

本标准替代的旧标准

IEC 60068-2-54 Ed. 1.0

替代本标准的新标准

IEC 60068-2-69 Ed. 3.0

等同采用的国际标准

NF EN 60068 2-54:2004 - Identical

JIS C 60068-2-54:1996 - Identical

UNE 20501-2-54:1994 - Identical

BS 2011-2.1Ta:1989 - Equivalent

DIN IEC 60068-2-54 (1988-01) - Identical

HD 323.2.54:1987 - Identical

NEN 10068-2-54:1986 - Identical