CEI EN 60068-2-69 : 2008现行
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
出版：Comitato Elettrotecnico Italiano
专家解读视频
基本信息
标准编号： CEI EN 60068-2-69 : 2008
发布时间：2008/1/1 0:00:00
标准类别：Standard
出版单位：Comitato Elettrotecnico Italiano
标准页数：52
标准简介
Describes the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
本标准替代的旧标准
等同采用的国际标准
IEC 60068-2-69 : 3.0 - Identical
EN 60068-2-69 : 2017 COR 2018 - Identical
IEC 60068-2-69 : 3.0 - Identical
