SN EN ISO 9455-17:2006现行
Soft Soldering Fluxes - Test Methods - Part 17: Surface Insulation Resistance Comb Test And Electrochemical Migration Test Of Flux Residues
出版：Swiss Standards
专家解读视频
Describes a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders.
NBN EN ISO 9455-17:2006 - Identical
NF EN ISO 9455-17:2006 - Identical
DIN EN ISO 9455-17 (2006-09) - Identical
BS EN ISO 9455-17:2006 - Identical
UNI EN ISO 9455-17:2007 - Identical
I.S. EN ISO 9455-17:2006 - Identical
ONORM EN ISO 9455-17:2006 - Identical
ISO 9455-17:2002 - Identical
NEN EN ISO 9455-17:2006 - Identical
SS EN ISO 9455-17 Ed. 1 (2006) - Identical
UNE EN ISO 9455-17:2007 - Identical
NS EN ISO 9455-17 Ed. 1 (2006) - Identical
