DS EN 60749-21:2011现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 21: Solderability
出版：Danish Standards
专家解读视频
基本信息
标准编号： DS EN 60749-21:2011
发布时间：2011/10/28 0:00:00
标准类别：Standard
出版单位：Danish Standards
标准页数：32
标准简介
Defines a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
等同采用的国际标准
EN 60749-21:2011 - Identical
