
Soft Solder Alloys - Chemical Compositions And Forms
出版:International Organization for Standardization

专家解读视频
基本信息
标准编号: ISO/DIS 9453 (2006)
标准类别:Draft
出版单位:International Organization for Standardization
标准页数:0
标准简介
Specifies the requirements for chemical composition for the following families of soft solder alloys:- tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;- tin-antimony;- tin-bismuth;- tin-copper, with and without silver;- tin-indium, with and without silver and bismuth;- tin-silver, with and without copper and bismuth;- tin-zinc, with and without bismuth.
替代本标准的新标准