BS EN 61189-5-3:2015现行
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 5-3: General Test Methods For Materials And Assemblies - Soldering Paste For Printed Board Assemblies
出版：British Standards Institution
专家解读视频
Defines methodologies and procedures that can be applied to test printed board assemblies.
Renumbers and supersedes BS IEC 61189-5-3. 2015 version incorporates corrigendum to BS IEC 61189-5-3. Supersedes 12/30274800 DC. (04/2015)
EN 61189-5-3 : 2015 - Identical
IEC 61189-5-3 : 1ED 2015 - Identical
EN 61189-5-3:2015 - Identical
