DIN EN 60749-15 (2009-06)废止
Semiconductor devices - Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2014/CDV:2009); German version FprEN 60749-15:2009
出版：German Institute for Standardisation (Deutsches Institut für Normung)
专家解读视频
