
Wire Bond Shear Test Method
出版:JEDEC Solid State Technology Association

专家解读视频
基本信息
标准编号: EIA JESD 22-B116:2009
发布时间:2009/8/1 0:00:00
标准类别:Standard
出版单位:JEDEC Solid State Technology Association
标准页数:0
标准简介
Defines a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts.
标准备注
Supersedes EIA JESD 22 (07/2004)
替代本标准的新标准