
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 3-719: Test Methods For Interconnection Structures (Printed Boards) - Monitoring Of Single Plated-Through Hole (Pth) Resistance Change During Temperature Cycling
出版:Comitato Elettrotecnico Italiano

专家解读视频
基本信息
标准编号: CEI EN 61189-3-719 Ed. 1 (2016)
标准类别:Standard
出版单位:Comitato Elettrotecnico Italiano
标准页数:20
标准简介
1ED 2016 [01/11/2016]
标准备注
Classificazione CEI 91-84. (12/2016)
等同采用的国际标准
EN 61189-3-719:2016 - Identical