
GENERIC SPECIFICATION: FILM & HYBRID INTEGRATED CIRCUITS
出版:Cenelec Electronic Components Committee

专家解读视频
Applies to Film and Hybrid Integrated Circuits (F&HICs) - both passive and active as defined in IEC 147-0B: second supplement to Publication 147-0. Includes part-completed F&HICs supplied to customers for subsequent processing, and to chip carrier circuits with more than one chip, provided that they, as separate products, have been interconnected by film interconnection techniques. Does not cover printed boards but is applicable to F&HICs which may include them. Defines quality assessment procedures and methods for electrical, climatic and mechanical testing and describes requirements to be applied to release of products using either qualification approval procedures or capability approval procedures.
NFC 86 410 : AMD 1 89 - Identical
BS CECC63000(1990) : 1990 - Identical
NBN C 83 350 : 1985 - Identical
BS CECC63000(1985) : AMD 5489 - Identical
NBN C 83 355 : 1985 - Identical
NBN C 83 300 : 1985 - Identical
DIN 45941-1 : 1985 - Corresponds
BS 9450(1998) : 1998 - Similar to
BS CECC63000(1990) : 1990 - Identical