
Test Methods For Electrical Materials, Printed Boards And Other Interconnection Structures And Assemblies - Part 5-4: General Test Methods For Materials And Assemblies - Solder Alloys And Fluxed And Non-fluxed Solid Wire For Printed Board Assemblies (iec 61189-5-4:2015)
出版:German Institute for Standardisation (Deutsches Institut für Normung)

专家解读视频
2015 [01/11/2015]DRAFT 2013 [01/07/2013]
Partially supersedes DIN EN 61189-5. DIN EN 61189-5 issue 05-2007 remains valid alongside this standard until 12-02-2018. (12/2015)
EN 61189-5-4:2015 - Identical