DS EN 61191-3:1999被替代
Printed Board Assemblies - Part 3: Sectional Specification - Requirements For Through-Hole Mount Soldered Assemblies
出版：Danish Standards
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基本信息
标准编号： DS EN 61191-3:1999
发布时间：1999/11/8 0:00:00
标准类别：Standard
出版单位：Danish Standards
标准页数：44
标准简介
Specifies requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
替代本标准的新标准
等同采用的国际标准
EN 61191-3:2017 - Identical
