DIN IEC 60191-6-21 (2009-02)被替代
Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
出版：German Institute for Standardisation (Deutsches Institut für Normung)
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