DIN IEC 60191-6-17 (2007-10)被替代
Mechanical standardization of semiconductor devices Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) (IEC 47D/690/CD:2007)
出版：German Institute for Standardisation (Deutsches Institut für Normung)
专家解读视频
