IEC 60068-2-69 : 2017+AMD 1 : 2019现行
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
出版：International Electrotechnical Committee
专家解读视频
基本信息
标准编号： IEC 60068-2-69 : 2017+AMD 1 : 2019
发布时间：2019/6/19 0:00:00
标准类别：Standard
出版单位：International Electrotechnical Committee
标准页数：0
标准简介
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
本标准替代的旧标准
等同采用的国际标准
BS EN 60068-2-69 : 2017+A1 : 2019 - Identical
BS EN 60068-2-69 : 2017+A1 : 2019 - Identical
