EIA JESD 22-B107:2011现行
Marking Permanency
出版：Joint Electronics Device Engineering Council (JEDEC)
专家解读视频
基本信息
标准编号： EIA JESD 22-B107:2011
发布时间：2011/3/1 0:00:00
标准类别：Standard
出版单位：Joint Electronics Device Engineering Council (JEDEC)
标准页数：14
标准简介
Specifies tests applicable for all package types. Aims to determine whether the marks on solid state semiconductor devices will remain legible (as defined per JESD22B-114) when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. They are suitable for use in qualification and/or process monitor testing. The mechanical shear test (tape test) is recommended as an ongoing process monitor or lot acceptance test. Electrical or mechanical rejects may be used for these tests.
标准备注
Supersedes EIA JESD 22 (07/2004)
本标准替代的旧标准
