I.S. EN 1758:1998现行

Defines the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with widths up to and including 100 mm. Thicknesses between 0.1 mm up to and including 1.0 mm are generally used for stamped lead frames for integrated circuits and low power devices and thicknesses from 1.0 mm up to and including 2.0 mm are generally used for stamped lead frames for high power devices.

NF EN 1758:1998 - Identical

ONORM EN 1758:1998 - Identical

DIN EN 1758 (1998-03) - Identical

SN EN 1758:1998 - Identical

NEN EN 1758:1998 - Identical

BS EN 1758:1998 - Identical

NBN EN 1758:1998 - Identical

UNI EN 1758:1999 - Identical

NS EN 1758 Ed. 1 (1998) - Identical

SS EN 1758 Ed. 1 (1998) - Identical

UNE EN 1758:1998 - Identical