IEC 60286-3 Ed. 4.0被替代
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
出版：International Electrotechnical Committee
专家解读视频
It is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. It also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). It contains the following significant technical changes with respect to the previous edition: a) implementation of Type IV (adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components); b) minor revisions related to tables, figures and references.
NEN EN IEC 60286-3:2007 - Identical
PN EN 60286-3:2008 - Identical
OVE/ONORM EN 60286-3:2008 - Identical
BS EN 60286-3:2007 - Identical
UNE EN 60286-3:2000 - Identical
UNE 20526-3:1996 - Identical
DIN IEC 60286-3 (1992-11) - Identical
CEI EN 60286-3 Ed. 3 (1999) - Identical
SS EN 60286-3 Ed. 1 (1998) - Identical
DIN EN 60286-3 (2008-04) - Equivalent
ONORM OVE EN 60286-3:1998 - Identical
CEI EN 60286-3 Ed. 4 (2008) - Identical
NF EN 60286-3:2008 - Identical
NF EN 60286-3:1999 - Identical
I.S. EN 60286-3:1998 - Identical
SN EN 60286-3:1998 - Identical
DIN EN 60286-3 (1998-12) - Equivalent
SS EN 60286-3 Ed. 2 (2007) - Identical
