IEC 60512-6-2 : 1.0现行
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 6-2: DYNAMIC STRESS TESTS - TEST 6B: BUMP
出版：International Electrotechnical Committee
专家解读视频
Aims to define a standard test method to assess the ability of components to withstand specified severities of bump.
CEI EN 60512-6-2 : 2003 - Identical
I.S. EN 60512-6-2:2002 - Identical
BS EN 60512-6-2 : 2002 - Identical
DS EN 60512-6-2 : 2002 - Identical
PN EN 60512-6-2 : 2006 - Identical
NEN EN IEC 60512-6-2 : 2002 - Identical
DIN EN 60512-6-2 : 2003 - Identical
