DS EN 60749-15:2011现行
Semiconductor Devices - Mechanical And Climatic Test Methods - Part 15: Resistance To Soldering Temperature For Through-Hole Mounted Devices
出版：Danish Standards
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基本信息
标准编号： DS EN 60749-15:2011
发布时间：2011/2/24 0:00:00
标准类别：Standard
出版单位：Danish Standards
标准页数：28
标准简介
Defines a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
等同采用的国际标准
EN 60749-15:2010 - Identical
