EIA JESD 22-B106:2008现行
Resistance To Solder Shock For Through-hole Mounted Devices
出版：JEDEC Solid State Technology Association
专家解读视频
基本信息
标准编号： EIA JESD 22-B106:2008
发布时间：2008/4/1 0:00:00
标准类别：Standard
出版单位：JEDEC Solid State Technology Association
标准页数：0
标准简介
Defines a procedure for determining whether through-hole solid state devices can withstand the effects of temperature to which they will be subjected during the soldering of their leads. The revision updates the references to current military standards.
标准备注
Supersedes EIA JESD 22 (07/2004)
本标准替代的旧标准
